At TRIUMF already:
DSSD 121813: Some scratches on surface. Top contact is not connected to Si, may be the one with 41, instead of 40.
MSPAD 1x7 3446-15B: Many bond wires disconnected in front. All 3 bond wires in back disconnected.
MSPAD 1x7 3446-15C ("Mechanical sample"): Front looks ok, one of the three back wires broken.
MSPAD 1x7 3446-16A: Chip disconnected from PCB, needs to be rebonded.
Design-I 3104-13: Front and rear bond wires look ok, had scratches.
Design-I 3104-14: Check connection on #4, some left-over wires, might be shorts? Rear bond wires ok.

Bring back to TRIUMF for test: Si Pads (Design I) 3 (in box), 6 (in box) , 8 (in box)

In safe at GSI: 
Housing 1 (BGO): Si Pad 9
Housing 2 (GAGG): 17A, DSSD 54, 17B, 17C, 16B, 16C
Housing X (none): Si Pads 5, 82, 81, 0?
Done a visual bond check for all detectors - looked ok.

In Alu box: DSSD-121812, old Si diode